With the continuous development of science and technology, precision grinding and polishing technology has become one of the most important processing techniques in electronic and mechanical parts manufacturing. Especially with the continuous development and maturity of modern semiconductor device manufacturing processes, the demand for high-precision and small batch production of microelectronic devices is becoming increasingly urgent. Precision grinding and polishing technology can control surface defects of workpieces at the micrometer level with high precision.

It is a method of polishing that combines advanced mechanical equipment and special grinding techniques. It can perform precise, efficient, and energy-saving grinding on various precision parts, with the advantages of high processing efficiency and low energy consumption. Therefore, it has a wide range of application prospects in the field of precision part grinding.

The production process of semiconductor devices and precision grinding and polishing process are highly comprehensive disciplines. This includes electric discharge grinding technology, grating abrasive removal technology, laser grinding technology, and surface strengthening technology.

If you need Abrasive Machines, Polishing Compounds, and consumables, please feel free to call us for consultation!